|Location:||Lyngby - Denmark|
|Placed On:||14th March 2019|
|Closes:||5th April 2019|
The Materials and Surface Engineering section in the Department of Mechanical Engineering at the Technical University of Denmark is seeking candidates for a postdoc position in the field of Corrosion Reliability of Electronic Systems and Devices starting from the 1st of June 2019. The position is initially for a period of 24 months.
The position is part of the CreCon industrial consortium on climatic reliability of electronics, therefore it involves close collaboration with industrial partners.
Humidity influence on corrosion reliability of electronics is a serious issue today due to the wide spread usage of electronics, which results in exposure to various climatic conditions. Printed Circuit Board Assembly (PCBA) is the main component of electronics that get influenced by humidity due to water film formation under transient climate conditions such as humidity and temperature as well as due to several inherent factors of the PCBA itself. Electrical property of the water film is essentially determined by the electrochemical aspects of the micro-cell formed on the PCBA surface when water film connects between neighboring biased points such as soldered connections or legs of components. The water film thickness formed under humid conditions can vary from nm scale to hundredths of nanometer depending on the humidity, temperature, hygroscopic residues, and PCBA parameters. Failure of electronics is determined by the interplay of these electrochemical sequences resulting in a parasitic circuit of different capacity interfering with the electrical aspects of the PCBA. Therefore understanding and controlling the water film build up, and knowledge on sequential changes in the electrochemical aspects leading to a critical level of parasitic current is important in controlling the humidity related failures in electronics.
Responsibilities and tasks
The intended Postdoc will focus on understanding the interplay between electrochemical mechanisms and failure of electronic devices due to change in electrical functionality under humid conditions due to thin water film formation. Work will involve investigations at PCBA and System level. Experimental methods involve electrochemical impedance and DC electrochemical methods to understand the electrochemical properties of the water film and interaction with PCBA surface. System level investigations will include humidity profiling inside the device in response to external conditions, and extrapolation of its effects on PCBA reliability.
Candidates should have
To apply, please read the full job advertisement at www.career.dtu.dk
Application deadline: 5 April 2019.
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