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WBG Device Engineers (Packaging & Chip Engineers)

Dynex Semiconductor Ltd - R&D Centre: Semiconductors


Keen to find a role that offers a challenge and an opportunity to develop future WBG chips and packaging for our growing customer base? The roles will include, not limited to:

WBG Chip Engineer

  • Project related activities within the R&D Centre involving the use of TCAD software tools to design and develop the power GaN semiconductor chip and module products.
  • Investigation of GaN or other WBG materials, new device concepts, and processes.
  • Perform manual and automatic wafer level and package level testing to characterise GaN Power devices including laboratory bench characterisation.
  • Understand the interactions between process, device design, and reliability of the device by performing detailed statistical data mining and analysis.
  • Providing written reports, oral presentations and publication as appropriate.

WBG Packaging Engineer

  • Undertakes project related activities within the R&D Centre with a particular focus on SiC and GaN-based wide-bandgap Power-Module Packaging: research; design, computer simulation; experimentation; testing and documentation. 
  • Working on applying advanced technologies for high power density and high efficiency WBG power modules design & packaging, gate drives, modulation techniques, and high frequency magnetic components.
  • Working on high speed SiC or GaN devices-based power modules and their challenges in protection, EMI/EMC, and parasitic control is expected.
  • Lead major project work and have responsibility for delivering high quality work.
  • Providing written and verbal engineering reports and presentations on work done as appropriate.


We are looking for a number of WBG Device Engineers who have experience working with power GaN chips and modules within a research and development capacity. To be considered for one of the roles you require:

WBG Chip Engineer

  • A relevant MS. or Ph.D. degree in Electrical Engineering, Physics or Material Science
  • Strong experienced with HEMT (High Electron Mobility Transistor), and power semiconductor devices physics and fabrication principles are essential.
  • Previous experience in a similar field is desirable.
  • Experience with GaN semiconductors device manufacturing and process development is essential.
  • Experience in finite element and mixed-mode TCAD simulations is essential.
  • Characterization of the semiconductor device parameter analyser, such as Agilent B1500 series or others.
  • Knowledge of chip tape-out flow and E-CAD tool.

WBG Packaging Engineer

  • A PhD degree in a science or engineering subject or equivalent relevant industrial experience in semiconductor packaging engineering.
  • Solid knowledge in SiC or GaN devices and related packaging technologies.
  • Proficient in some of modelling tools such as: 3D mechanical, Ansys Maxwell, Simplorer, Q3D, PLECS, and LTSpice/PSpice.
  • Experience of SolidEdge or other drawing software.
  • Knowledge of gate drives, DC/AC, DC/DC, high frequency inductive and capacitive components, EMI/EMC, thermal and cooling are desirable.
  • Experiences of multilayer high frequency and high-power PCB design are desirable.
  • Experiences of SMD packages of both ICs and passive components.
  • Knowledge of the challenges and requirements of power semiconductor device and module electrical, thermal test and characterization.
  • Knowledge and experience in power semiconductor packaging, materials and fabrication process.
  • Prototyping and experimental experience of medium to high power converters (650V-1200V, 150kW-200kW) is welcomed but not essential.


We have several exciting opportunities to join our growing and successful organisation that is on a very exciting journey. If you feel you have the skills and experience to add value in this position, please apply now by clicking the apply button above. The application process is a simple submission of your most up to date CV.

Applications are reviewed within 2-3 days of submission and we ensure that we always provide feedback to applicants.


If you have any questions at all, please do get in touch with member of our HR Team on where you can request an informal conversation about the role requirements. Ideally include your CV, availability and contact details. 

Job Location: Doddington Road, Lincoln, LN6 3LF

Flex Time and a hybrid of office/home working, after successful probationary.

Location: Lincoln, Work from Home
Salary: Highly Competitive with comprehensive benefits package including visa sponsorship and relocation
Hours: Full Time
Contract Type: Permanent
Placed On: 5th November 2021
Closes: 3rd January 2022
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