|Funding for:||UK Students|
|Funding amount:||Payment of UK tuition fees for up to 3.5 years, an annual tax-free maintenance stipend at the standard UKRI rate (£16,062 in 2022-23) for up to 3.5 years and access to a Research Training and Support Grant to support research costs for up to 3.5 years.|
|Placed On:||16th May 2022|
|Closes:||30th June 2022|
Applications are invited for a fully-funded 3.5 year PhD studentship to develop novel optical sensing instrumentation and electronics within high-value manufacturing applications. This is an exciting opportunity for a highly motivated candidate with a strong academic record to set themselves up for a career within the development of electronics and instrumentation. This position is ideally suited to a candidate who wishes to develop expertise in the design of electronics and associated instrumentation, specifically related to optical sensing based applications. During the project, the candidate will be given opportunities to work with a wide range of collaborators, within both academia and in industry. Upon the completion of the PhD, the candidate will be ideally placed to pursue a successful career within electronics and instrumentation in either academia or industry.
Optical sensing is used within a wide range of instrumentation, including thermal imaging, radiation thermometry, Lidar and hyperspectral imaging. During the course of this PhD, the candidate will develop instrumentation for one or more of these themes, enabling new capabilities within optical sensing and measurement. One key application is that of high value manufacturing, where high quality measurement data is critical for process optimisation, leading to higher quality material and a reduction in the process’ carbon footprint. Results will be disseminated in high quality journal papers, and the candidate will have the opportunity to present their research at conferences.
The project is expected to involve the development of electronic circuitry and instrumentation with an optical sensor at its core, including design of analogue and/or digital electronics. We are looking to take embedded systems, such as the Xilinx-Zynq, Jetson Nano or the STM Discovery range, and, for the first time, introduce artificial intelligence and machine learning to thermal and/or hyperspectral sensors. We work closely with Tata Steel and Additive Manufacturing researchers, where use of such instrumentation would be highly beneficial. By incorporating such systems within these applications, we would be able to uncover important patterns within the thermal and spectral signatures during the process, with artificial intelligence used to improve the final process. The candidate will be supported within their research by an experienced team of multi-disciplinary researchers; team working and collaboration are highly valued traits within the research group.
About the Research Group:
The project will take place within the Sensor Systems Group within the Electronic and Electrical Engineering department. The group specialises in the development of novel optical sensor based instrumentation, for both academic and industrial application. The group work with several industrial collaborators, including Tata Steel and Rolls-Royce. The candidate will benefit from working within a large research group, learning from experienced members of staff and other PhD students, from a diverse range of backgrounds and disciplines.
Applicants should have, or expect to achieve, at least a 2:1 Bachelors/Masters Honours degree in Electronic Engineering, Physics or a closely related discipline. The student should have skills in, or would like to develop skills in, electronics design related to measurement instrumentation, including analogue and/or digital electronics. The studentship is available to home applicants only, and will start in October 2022.
Application and enquiries:
For more information and informal enquiries about this position, please contact Dr. Matthew Hobbs (firstname.lastname@example.org). To apply for this position, please submit a CV and covering letter via e-mail, or via the Apply Link.
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