PhD Studentship: Net Zero Manufacturing of Advanced Ceramics

Advanced ceramics are vital materials for fulfilling the growing demand for higher performance across numerous advanced manufacturing sectors.

This project will be investigating the use, design and additive manufacture (AM) of ceramics/composites along with field-assisted sintering techniques (FAST) for their processing. Making complex-shaped ceramics is often very difficult and the sintering processes used to manufacture them are extremely energy intensive.

The work will contribute to solving these manufacturing challenges through the adoption of sustainable AM and the use of energy-efficient, environmentally benign, net-zero methods to enhance the densification kinetics for ceramics/composites.

Combining AM and FAST presents an opportunity to be involved with enabling state-of-the-art ceramics processing and making designed components for demanding applications. You will use existing materials formulation, characterisation and processing methodologies as well as develop/assess a novel combination of bespoke printing and processing techniques capable of fabricating multi-component ceramics. You will be part of the 'Strength in Places' Project programme led by Prof. Vaidhyanathan.

Funding

Tuition fees cover the cost of your teaching, assessment and operating University facilities such as the library, IT equipment and other support services. University fees and charges can be paid in advance and there are several methods of payment, including online payments and payment by instalment. Fees are reviewed annually and are likely to increase to take into account inflationary pressures.

The studentship is for 3 years and provides a tax-free stipend of £17,668 per annum for the duration of the studentship plus tuition fees at the UK rate.  International (including EU) students may apply however the total value of the studentship will cover the International Tuition Fee Only. Additional funding may be provided for industrial partner visits, field research, travel and conference expenses.

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